Method of manufacturing conductive film

Provided is a method of manufacturing a conductive film that can suppress the generation of wrinkles in a resin film even when forming a thicker conductive layer. The method comprises a step A of forming a first conductive layer on one surface of the resin film; a step B of laminating a protective f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKAO HIROYUKI, BEPPU HIROSHI, KOISHI NAOKI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:Provided is a method of manufacturing a conductive film that can suppress the generation of wrinkles in a resin film even when forming a thicker conductive layer. The method comprises a step A of forming a first conductive layer on one surface of the resin film; a step B of laminating a protective film on the first conductive layer; and a step C of forming a second conductive layer with a thickness of 80 nm or more and 300 nm or less the other side of the resin film by sputtering, while discharging the resin film. 提供在形成较厚的导电层时也可抑制树脂薄膜的褶皱的产生的导电性薄膜的制造方法。一种导电性薄膜的制造方法,其包括:工序A,在树脂薄膜的一个面形成第1导电层;工序B,在前述第1导电层上贴合保护薄膜;及工序C,边放出前述树脂薄膜边通过溅射法在前述树脂薄膜的另一面形成厚度80nm以上且300nm以下的第2导电层。