Component, method of manufacturing component, and method of cleaning component

A component, a method of manufacturing a component, and a method of cleaning a component is provided. The component includes a gas flow system within the component, wherein the gas flow system fluidlycouples one or more inlet holes and one or more outlet holes. The manufacturing of the component res...

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Bibliographische Detailangaben
Hauptverfasser: RODARTE FRANCISCO, WIDLOW IAN, NAIK ARAVIND, GONDHALEKAR SUDHIR, RAJ GOVINDA, KEPPERS GARY, KODINAGANHALLI RAVIKUMARA
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A component, a method of manufacturing a component, and a method of cleaning a component is provided. The component includes a gas flow system within the component, wherein the gas flow system fluidlycouples one or more inlet holes and one or more outlet holes. The manufacturing of the component results in an arc shaped groove and a circumferential groove created in the body of the ring. The component undergoes one or more cleaning operations, including rinsing, baking, or purging operations. The cleaning operations remove debris or particles in or on the component, where the debris or particles can be caused during manufacturing of the component, or during use of the component in a semiconductor processing system. 提供了一种部件、一种制造部件的方法、以及一种清洁部件的方法。所述部件包括在所述部件内的气体流动系统,其中所述气体流动系统流体地耦接一个或多个入口孔和一个或多个出口孔。所述部件的所述制造产生在环的主体中产生的弧形凹槽和周向凹槽。所述部件经受一个或多个清洁操作,包括冲洗、烘烤或净化操作。所述清洁操作去除在所述部件中或所述部件上的碎屑或颗粒,其中所述碎屑或颗粒可能是在所述部件的所述制造期间、或在半导体处理系统中使用所述部件期间引起的。