SEMICONDUCTOR MODULE WITH PACKAGE EXTENSION FRAMES

A semiconductor package includes a semiconductor module, a first package extension frame, a second package extension frame, and a plurality of fasteners. The semiconductor module includes a first sidesurface, a second side surface, a first major surface, and a second major surface on an opposite side of the semiconductor module from the first major surface. The first package extension frame is configured to attach to the first side surface. The second package extension frame is configured to attach to the second side surface. The plurality of fasteners are configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first major surface and/or a heat sink arranged on the second major surface. 本发明公开了一种半导体封装，其包括半导体模块、第一封装扩展框架、第二封装扩展框架和多个紧固件。半导体模块包括第一侧表面、第二侧表面、第一主表面和在半导体模块的与第一主表面相对的一侧上的第二主表面。第一封装扩展框架被配置为附接到第一侧表面。第二封装扩展框架被配置为附接到第二侧表面。多个紧固件被配置为将第一封装扩展框架和第二封装扩展框架机械地耦合到布置在第一主表面上的电路板和/或布置在第二主表面上的散热器中的一个或多个。