SUBSTRATE PROCESSING APPARATUS

A substrate processing apparatus may include a stage having a plane defined by a first direction and a second direction crossing each other, a pin arranged in an opening defined in the stage and extending in a third direction crossing the plane, and a bushing portion below the stage. The pin may be inserted in an insertion hole defined in the bushing portion, the insertion hole may overlap with the opening, and a first hole extending to the insertion hole in a direction parallel to the plane may be defined in the bushing portion. 提供了一种基底处理设备。所述基底处理设备可以包括：台，具有由彼此交叉的第一方向和第二方向限定的平面；销，布置在限定于台中的开口中并沿着与所述平面交叉的第三方向延伸；以及衬套部，位于台的下方。销可以插入限定在衬套部中的插入孔中，插入孔可以与开口叠置，并且沿着平行于所述平面的方向延伸至插入孔的第一孔可以被限定在衬套部中。