Ultra-thin copper strip annealing non-strip-sticking process
The invention discloses an ultra-thin copper strip annealing non-strip-sticking process. The ultra-thin copper strip annealing non-strip-sticking process comprises the steps that after an ultra-thin copper strip is rolled by a finishing mill, the ultra-thin copper strip first passes through a coil o...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an ultra-thin copper strip annealing non-strip-sticking process. The ultra-thin copper strip annealing non-strip-sticking process comprises the steps that after an ultra-thin copper strip is rolled by a finishing mill, the ultra-thin copper strip first passes through a coil opening machine and then is sent to a bell-type annealing furnace for high-temperature annealing; theroughness of a roller the finishing mill is controlled at 0.35-0.2[mu]m, the rolling oil viscosity of the finishing mill is controlled at 7.5-8.8mm /s, the winding tension of the coil opening machine is controlled at 1.3-3.3KN, and the heating rate of the bell-type annealing furnace is controlled at 90-120 DEG C/h. Process parameters are further optimized on the basis of original copper strip production annealing process, so that the non-strip-sticking process of a copper strip is still realized without the addition of an anti-sticking agent, the anti-sticking agent volatilized into the airis not necessarily inhaled, |
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