Vinyl phenyl silicone resin for LED packaging adhesive as well as preparation method and application thereof
The invention belongs to the technical field of LED packaging adhesives, and particularly discloses vinyl phenyl silicone resin for an LED packaging adhesive and a preparation method and an application of the vinyl phenyl silicone resin. According to the invention, the vinyl-containing organosiloxan...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention belongs to the technical field of LED packaging adhesives, and particularly discloses vinyl phenyl silicone resin for an LED packaging adhesive and a preparation method and an application of the vinyl phenyl silicone resin. According to the invention, the vinyl-containing organosiloxane is used as a vinyl donor, a hydrolysis condensation method is adopted to synthesize a vinyl-containing organosiloxane intermediate, the content of vinyl is easy to control, and the problems of small crosslinking density and low viscosity of vinyl silicone resin caused by using vinyl double end sockets as the vinyl donor traditionally are avoided. According to the preparation method, methyl trimethoxy silane is used for eliminating hydroxyl of a vinyl phenyl silicone resin oligomer, so that a large amount of loss of vinyl caused by reaction of epoxy ring opening and vinyl in a hydroxyl eliminating process due to use of epoxy-containing organosiloxane is avoided, and later curing is facilitated to obtain a packagin |
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