Die-to-die communications scheme

The disclosure relates to a die-to-die communication scheme. Examples described herein provide a communication scheme between integrated circuit (IC) dies. In an example, an IC package includes a first IC die and a second IC die. The first IC die includes an encoder/decoder configured to implement encoded communications. The second IC die includes a transceiver configured to implement unencoded differential communications. The encoder/decoder is communicatively coupled to the transceiver. The encoder/decoder is configured to implement communications to the transceiver using a subset of a codemap of the encoded communications. 本公开涉及一种裸片至裸片的通信方案。这里所描述的示例提供了集成电路(IC)裸片之间的通信方案。在一个示例中，IC封装件包括第一IC裸片和第二IC裸片。第一IC裸片包括被配置为实现编码通信的编码器/解码器。第二IC裸片包括被配置为实现未编码差分通信的收发器。编码器/解码器通信地耦合到收发器。编码器/解码器被配置为使用编码通信的代码映射的子集来实现与收发器的通信。