Ultrathin Au-Sn solder cutting device

The invention provides an ultrathin Au-Sn solder cutting device, and belongs to the technical field of solder cutting. The device comprises a fixing rack, a raw material assembly, a feeding assembly and a cutter assembly. The raw material assembly comprises a solder wheel for winding a solder and a wheel support for supporting the solder wheel. The feeding assembly comprises a transverse motion mechanism and a longitudinal motion mechanism for driving the transverse motion mechanism to move longitudinally. The longitudinal motion mechanism is arranged on the fixing rack. The wheel support is installed on the transverse motion mechanism or installed on a sliding block of the longitudinal motion mechanism. The transverse motion mechanism is used for conveying the solder wound on the solder wheel. The cutter assembly is used for cutting the solder conveyed to the cutter assembly. The ultrathin Au-Sn solder cutting device is high in cutting efficiency and capable of saving time and labor,the cut solder is high in