Wiring layer structure, preparation method thereof and bonding pad structure

The invention provides a wiring layer structure, a preparation method thereof and a bonding pad structure. The wiring layer structure comprises a dielectric medium; a wire layer is embedded in the dielectric medium; the wire layer comprises a frame body and connecting wires; the frame body at least comprises two openings; the frame body is divided into a plurality of sections; the connecting wiresare located in the frame body; each connecting wire is provided with a plurality of connecting ends connected to the frame body; the connecting wires divide the interior of the frame body into a plurality of areas; each section is connected with the connecting ends of any connecting wire; and each area is communicated with any opening. According to the wiring layer structure, the preparation method thereof and the bonding pad structure of the invention, the whole wire layer and the dielectric medium are separately of an integrated structure, and therefore, an adhesive force between the interior of the wire layer and