Dynamic grinding force measuring method for grinding device

The invention discloses a dynamic grinding force measuring method for a grinding device. According to the stress condition of a workpiece during grinding, firstly, an isolator needing mechanical analysis is determined, secondly, the contact force between the tail end of a grinding tool and the workp...

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Bibliographische Detailangaben
Hauptverfasser: LUO XINHE, SHAN QI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a dynamic grinding force measuring method for a grinding device. According to the stress condition of a workpiece during grinding, firstly, an isolator needing mechanical analysis is determined, secondly, the contact force between the tail end of a grinding tool and the workpiece is analyzed, thirdly, the stress of a pressure-torsion coupling sensor is analyzed, and finally, a mechanical model during workpiece grinding is established to solve the target force and torque. According to the invention, direct measurement can be carried out, the speed is high, the precisionis high, the price is low, and universality is realized. 本发明公开一种用于磨削装置的动态磨削力测量方法,根据工件磨削时的受力情况,首先确定需进行力学分析的隔离体,其次对磨削工具末端与工件之间的接触力进行分析,再对压扭耦合传感器的受力进行分析,最后建立工件磨削时的力学模型求解目标力和力矩。本发明可进行直接测量,速度快,精度高,价格低,且具有普适性。