High durability solder terminals

High durability solder terminals

An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YAMAJI TORU, YASHIRO YUJI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESONATORS
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Beschreibung
Zusammenfassung:An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad. 电子器件封装包括：下表面，用于传导电子信号；第一焊料焊盘，设置在所述下表面上，具有第一尺寸；以及多个第二焊料焊盘，设置在所述下表面上并围绕所述第一焊料焊盘，具有小于所述第一尺寸的第二尺寸。