Semiconductor package

The invention provides a semiconductor package, which may include a connection structure including one or more redistribution layers. A semiconductor chip is disposed on the connection structure and has an active surface on which a connection pad electrically connected to the redistribution layer is disposed and an inactive surface opposite to the active surface. An encapsulant is disposed on theconnection structure and covers at least a portion of the inactive surface of the semiconductor chip. A conductor pattern layer is embedded in the encapsulant such that one exposed surface of the conductor pattern layer is exposed from the encapsulant. A metal layer is disposed on the encapsulant and covers the one exposed surface of the conductor pattern layer. 本发明提供一种半导体封装件，所述半导体封装件可包括连接结构，所述连接结构包括一个或更多个重新分布层。半导体芯片设置在所述连接结构上并具有有效表面和与所述有效表面背对的无效表面，所述有效表面上设置有电连接到所述重新分布层的连接垫。包封剂设置在所述连接结构上并覆盖所述半导体芯片的所述无效表面的至少一部分。导体图案层嵌在所述包封剂中使得所述导体图案层的一个暴露表面从所述包封剂暴露。金属层设置在所述包封剂上并覆盖所述导体图案层的所述一个暴露表面。