Single ring design for high yield, substrate extreme edge defect reduction in ICP plasma processing chamber

The invention relates to single ring design for high yield, substrate extreme edge defect reduction in ICP plasma processing chamber. Embodiments of the invention provide a single ring comprising a circular ring-shaped body with an inner surface, closest in proximity to a centerline of the body, and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LANE ADAM, DAO HUUTRI, NG SIU TANG, WILLWERTH MICHAEL D, C LI
Format: Patent
Sprache:chi ; eng
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