Device for measuring thickness of any point of free-form surface and measuring method thereof

The invention discloses a device for measuring the thickness of any point of a free-form surface and a measuring method thereof. The device comprises an ultrasonic thickness measurement main body structure, a buffer connection structure and a coupling agent supply structure. The ultrasonic thickness...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BU XIONGZHU, CAO YIHAN, BU WEIXIONG, DING YUEFENG, LIU SHUO, GU SHIJU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a device for measuring the thickness of any point of a free-form surface and a measuring method thereof. The device comprises an ultrasonic thickness measurement main body structure, a buffer connection structure and a coupling agent supply structure. The ultrasonic thickness measurement main body structure is used for probe angle self-adaptive adjustment and probe and workpiece contact force measurement so that a measurement axis and a vector normal of a workpiece contact point are self-adaptive coincident and stable in contact; the buffer connection structure is usedfor guaranteeing coaxial connection between the thickness measurement main body structure and the tail end of an external movement mechanism and has buffer and guide effects at the same time; and thecoupling agent supply line ensures stable coupling of the probe and the workpiece. The device can solve the problem of automatic detection of the thickness of a thin-wall complex curved surface workpiece and can be installed a