Special tin surface protective agent for precision circuit board line manufacturing, and production method thereof

The invention discloses a special tin surface protective agent for precision circuit board line manufacturing, and a production method thereof. The preparation method comprises the following steps: taking an organic solvent ethyl acetate, adding nano silicon dioxide, lauryl sodium sulfate, a stabilizer, sodium hypophosphite and octylphenol polyoxyethylene ether into the organic solvent, and fullymixing to obtain a material A; heating a resin, an anti-aging agent, a drier and benzotriazole to 300 DEG C through burdening, and fully mixing to obtain a material B; feeding the material A into a high-frequency furnace, and carrying out high-frequency oscillation, wherein the temperature is controlled to be 180-220 DEG C; controlling the time based on the raw materials, discharging after preliminary puffing to obtain a material C; and adding the material B into the material C, and fully mixing. In the prior art, part of raw materials in a special tin surface protective agent for a circuit board line are difficult to