Uv-curable adhesive composition, cured product thereof, and method for manufacturing optical member employing UV-curable adhesive composition

Provided is (1) a UV-curable adhesive composition that is a resin composition used to bond at least two optical substrates with each other, and contains an intramolecular-hydrogen-abstracting photopolymerization initiator (A), a photopolymerizable oligomer (B) and a (meth)acrylate monomer (C). The p...

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Bibliographische Detailangaben
Hauptverfasser: MOTOHASHI HAYATO, UEHARA MICHIKO, NAITOU NOBUHIKO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Provided is (1) a UV-curable adhesive composition that is a resin composition used to bond at least two optical substrates with each other, and contains an intramolecular-hydrogen-abstracting photopolymerization initiator (A), a photopolymerizable oligomer (B) and a (meth)acrylate monomer (C). The proportion at which a solvent is contained in the resin composition is equal to or less than 5 wt%, the weight average molecular weight of the photopolymerizable oligomer (B) falls within a range of 7000 to 100000, and the transmittance of the cured product of the resin composition for light in a wavelength range of 450 to 800 nm is equal to or greater than 85%. 一种紫外线硬化型粘合剂组合物,其为用以将至少2个光学基材贴合的树脂组合物,含有分子内夺氢型光聚合引发剂(A)、光聚合性低聚物(B)及(甲基)丙烯酸酯单体(C),上述树脂组合物中的溶剂的含有比例为5重量%以下,光聚合性低聚物(B)的重量平均分子量为7000~100000的范围,上述树脂组合物的硬化物于450~800nm的波长区域中的光的透射率为85%以上。