Processing device and processing method

This processing device has: a support column (22) that has a plurality of workpiece attachment surfaces (25); a first processing unit (32A) and a third processing unit (32C) that perform processing with respect to two mutually opposing surfaces of at least one workpiece (W) fixed to one of the workp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: UEKI YOSHIHITO, ARAKAWA SHUGO, HIRANO YOSHIHIKO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:This processing device has: a support column (22) that has a plurality of workpiece attachment surfaces (25); a first processing unit (32A) and a third processing unit (32C) that perform processing with respect to two mutually opposing surfaces of at least one workpiece (W) fixed to one of the workpiece attachment surfaces (25) of the support column (22); and a second processing unit (32B) that performs processing at the same time as the first processing unit (32A) and the third processing unit (32C) on a plurality of workpieces (W) respectively fixed to one workpiece attachment surface (25) and to two workpiece attachment surfaces (25) which are perpendicular to the one workpiece attachment surface (25), among the plurality of workpiece attachment surfaces (25). 本发明所涉及的加工装置具有:支柱(22),其具有多个工件安装面(25);第1加工单元(32A)和第3加工单元(32C),二者分别对被固定在支柱(22)的1个工件安装面(25)上的至少1个工件(W)的彼此相向的2个面进行加工;和第2加工单元(32B),其对被分别固定在多个工件安装面(25)中的1个工件安装面(25)、和与该1个工件安装面(25)正交的2个工件安装面(25)上的多个工件(W)同时进行加工。