Chip assembly and preparation method thereof

The invention discloses a chip assembly and a preparation method thereof. The chip assembly comprises a chip, a substrate, a heat dissipation cover and an elastic adsorption assembly. One surface of the substrate is divided into a first region and a second region; the second region surrounds the first region; the chip is arranged in the first region; the heat dissipation cover is provided with anopening, the adsorption assembly is arranged on the edge of the opening of the heat dissipation cover, the heat dissipation cover covers the chip, the adsorption assembly is located between the secondregion of the substrate and the opening end of the heat dissipation cover, the heat dissipation cover is provided with at least one notch, and the notch corresponds to the second region. The chip assembly provided by the invention has a good heat dissipation effect and good information transmission performance. 本发明公开了一种芯片组件及制备方法，所述芯片组件包括芯片、基板、散热罩和具有弹性的吸附组件。所述基板的一个表面划分为第一区域和第二区域，所述第二区域环绕所述第一区域，所述芯片设置于所述第一区域，所述散热罩具有开口，所述吸附组