Microwave power amplifier chip carrier and preparation method thereof
The invention discloses a microwave power amplifier chip carrier and a preparation method thereof. The microwave power amplifier chip carrier comprises a high silicon aluminum alloy substrate, a chipcushion block and a film capacitor; the chip cushion block comprises a chip welding metal layer and a...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses a microwave power amplifier chip carrier and a preparation method thereof. The microwave power amplifier chip carrier comprises a high silicon aluminum alloy substrate, a chipcushion block and a film capacitor; the chip cushion block comprises a chip welding metal layer and a carrier welding metal layer, and the film capacitor comprises a bonding layer, a dielectric layerand an electrode metal layer. The manufacturing method comprises the following steps: providing the high silicon aluminum alloy substrate with a polished surface, and sequentially forming the bondinglayer and the dielectric layer in a thin film capacitor region on the first surface of the substrate; forming the metal layer on the chip welding area on the first surface of the substrate and the surface of the thin-film capacitor dielectric layer; after a carrier welding metal layer is formed on the second surface of the substrate, performing scribing. According to the microwave power amplifierchip carrier and the manufac |
---|