REINFORCED SEMICONDUCTOR DIE AND RELATED METHOD

The subject of the invention is a reinforced semiconductor die and related methods. Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frameover the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the pluralityof die. 本发明题为"增强的半导体管芯及相关方法"。本发明公开了形成多个增强的管芯的方法的实施方式，该实施方式可以包括：在衬底上形成多个管芯；以及图案化金属组框架以形成多个金属板。多个金属板可以对应于多个管芯。该方法可以包括将金属组框架耦接在多个管芯上方并切单多个管芯。多个管芯中的每个管芯可以包括来自耦接在多个管芯上方的多个金属板中的对应金属板。