High-strength and high-conductivity copper-based composite material and preparation method thereof

The invention relates to the field of metal composite materials, in particular to a high-strength and high-conductivity copper-based composite material and a preparation method thereof. The preparation method comprises the following steps: (1) laminating more than two layers of copper foils deposite...

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Hauptverfasser: YANG WEISAN, GONG MING, LUAN YIFENG, CHEN QIANG, SUN BANGCHENG, LI MINGGAO, ZHANG XIAOHUI, LI YAOJUN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to the field of metal composite materials, in particular to a high-strength and high-conductivity copper-based composite material and a preparation method thereof. The preparation method comprises the following steps: (1) laminating more than two layers of copper foils deposited with graphene and then carrying out hot press molding to prepare a graphene-copper composite material; and (2) applying a pressure of 80-120 MPa to the graphene-copper composite material through inert gas at a temperature of 700-900 DEG C to perform hot isostatic pressing densification treatment.The metal high-strength and high-conductivity copper-based layered composite material prepared by the invention is good in compounding effect, and has high strength and high conductivity. Besides, thepreparation method is short in process, high in efficiency, beneficial to reducing the production cost and saving resources, environmentally friendly and convenient to apply and popularize. 本发明涉及金属复合材料领域,具体涉及一种高强高导铜基复合材料及其制备方