Surface grinding protecting sheet for semiconductor wafer

The invention discloses a surface grinding protecting sheet for a semiconductor wafer. The surface grinding protecting sheet comprises a substrate, wherein a middle layer is arranged on the substrate;a surface adhesion layer is arranged on the middle layer; the substrate is made from polyester and polyamide materials, and the substrate is 1-1000 [mu] thick; the middle layer is a thermoplastic solid high-molecular polymer, and the softening temperature of the thermoplastic solid high-molecular polymer is 50-80 DEG C by applying a pressure of 0.45 MPa based on an ASTM D1525 standard according to a vicat softening point temperature test of the thermoplastic solid high-molecular polymer; and the surface adhesion layer is prepared from acrylic polymers or polyurethane polymers and copolymersthereof. The surface grinding protecting sheet for the semiconductor wafer provides good concave-convex absorption and protection when the semiconductor wafer is ground to prevent damage of the semiconductor wafer. 本发明公开了一种半导体晶