Chip packaging method and chip

The invention discloses a chip packaging method and a chip, and the method comprises the steps: pasting an adhesive tape on a substrate, and enabling a to-be-packaged chip to be placed on the adhesivetape in a manner that the front surface of the to-be-packaged chip faces downwards in an inverted ma...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU ZHAOLIN, XING GUANGJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!