Chip packaging method and chip

The invention discloses a chip packaging method and a chip, and the method comprises the steps: pasting an adhesive tape on a substrate, and enabling a to-be-packaged chip to be placed on the adhesivetape in a manner that the front surface of the to-be-packaged chip faces downwards in an inverted manner; carrying out plastic package on the periphery of the packaged chip, and smoothing the back surface of the chip to enable the back surface of the chip to be flush with the top surface of the plastic package; removing the substrate and the adhesive tape to form a packaging body of which the front surface and the back surface of the chip are exposed and the periphery is provided with a first plastic package. According to the invention, the front surface and the back surface of the chip are directly exposed, so the size of the cavity type packaging structure is reduced, the signal transmission efficiency and speed are improved, the cavity type packaging structure can be integrated in traditional IC packaging, FOW