Ball grid array packaged ball mounting structure and ball mounting method

The invention provides a ball grid array packaged ball mounting structure and a ball mounting method, and belongs to the technical field of chip packaging. The ball grid array packaged ball mounting structure comprises a substrate, a bonding pad layer, a central copper core ball array and a conventional welding ball group; wherein a front surface of the substrate is used for bonding a high-power chip, and a guide pillar used for conducting the front surface and a back surface of the substrate is arranged on the substrate in a penetrating manner; the bonding pad layer is arranged on the back surface of the substrate, is communicated with the front surface of the substrate and is connected with the high-power chip through a lead; the central copper core ball array is planted on the bonding pad layer, and the position of the central copper core ball array is used for being aligned with a back surface of the high-power chip; and the conventional solder ball group is planted on the bondingpad layer and surrounds t