Method for checking internal appearance defect of COB module after glue sealing

The invention relates to the field of LED packaging, in particular to a method for checking internal appearance defects of a COB module after glue sealing. The method comprises a transparent high-temperature adhesive tape, a laminator, a microscope and a glue-sealed COB module semi-finished product....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHAO ANWEN, GONG WEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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