Method for checking internal appearance defect of COB module after glue sealing

The invention relates to the field of LED packaging, in particular to a method for checking internal appearance defects of a COB module after glue sealing. The method comprises a transparent high-temperature adhesive tape, a laminator, a microscope and a glue-sealed COB module semi-finished product. An adhesive attaching surface of the transparent high-temperature adhesive tape is attached to a packaging adhesive body of the COB module semi-finished product, then, the transparent high-temperature adhesive tape and packaging glue of the COB module semi-finished product are seamlessly and tightly attached to each other on a laminator with a rubber roller by heating the rubber roller, and the surface of the packaging glue of the COB module semi-finished product is roughened by using an adhesive of the transparent high-temperature adhesive tape, filling and leveling up are performed, and finally the interior of the packaging glue of the COB module semi-finished product is observed under amicroscope. Through the c