Latent resin composition, prepreg and epoxy composite material

The invention discloses a latent resin composition, a prepreg and an epoxy composite material. The latent resin composition comprises epoxy resin, a curing agent, an accelerant, a toughening agent anda solvent, wherein the curing agent comprises a main curing agent and an auxiliary curing agent, the...

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Bibliographische Detailangaben
Hauptverfasser: FU CHUXIAN, CHEN WENQUAN, CHEN HUAGANG, SHEN QUANJIN, HONG JIJIAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a latent resin composition, a prepreg and an epoxy composite material. The latent resin composition comprises epoxy resin, a curing agent, an accelerant, a toughening agent anda solvent, wherein the curing agent comprises a main curing agent and an auxiliary curing agent, the main curing agent comprises an organic hydrazide latent curing agent, and the auxiliary curing agent comprises one or a combination of more of a dicyandiamide latent curing agent, an aromatic amine latent curing agent, an organic anhydride latent curing agent and a Lewis acid amine complex. The latent resin composition disclosed by the invention can be quickly cured under a medium-temperature condition, the prepared prepreg can be stored for a long time under normal-temperature and cold-storage conditions, the preparation process is simple and convenient, equipment is simple and easy to operate, and the epoxy composite material can be ensured to have relatively good thermodynamic properties and mechanical properti