Composite part compaction device

The present application provides a device and method for compacting laminates. One embodiment is a method for compacting a laminate onto the surface of a forming tool. The method includes placing thelaminate on the forming tool, setting the compacting equipment above the laminate, clamping the compa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DUNCAN EDWARD RAY, HALBRITTER ALLEN JAMES
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present application provides a device and method for compacting laminates. One embodiment is a method for compacting a laminate onto the surface of a forming tool. The method includes placing thelaminate on the forming tool, setting the compacting equipment above the laminate, clamping the compacting equipment to the forming tool, using a pressure foot of the compacting equipment to compact the laminate, and removing the compacting equipment from the forming tool. 本申请提供了用于压实层压件的装置和方法。一个实施例是用于将层压件压实到成形工具的表面上的方法。该方法包括将层压件放置在成形工具上,将压实设备设置在层压件上方,将压实设备夹持到成形工具,利用压实设备的压力脚压实层压件,以及从成形工具上移除压实设备。