METHOD FOR INTEGRATING AN ELECTRICAL CIRCUIT IN A DEVICE AND DEVICE

The invention relates to a method for integrating an electrical circuit (130) into a device (100). The device (100) has an integration surface (112) consisting of a first material (110). The method according to the invention comprises a step of processing the integration surface (112) in order to form connection elements (114) in order to increase an adhesion of a second material (120) to the integration surface (112). The second material (120) differs from the first material (110). The method also comprises a step of arranging the electrical circuit (130) adjacent to the processed integrationsurface (112). The method furthermore comprises a step of applying a volume of the second material (120) at least over the integration surface (112) in order to enclose the electrical circuit (130) in a fluid-tight manner. 本发明涉及一种用于将电路（130）集成到设备（100）中的方法。设备（100）具有由第一材料（110）制的集成表面（112）。所述方法具有加工集成表面（112）的步骤，以便形成用于提高第二材料（120）在集成表面（112）上的附着力的连接元件（114）。在此，第二材料（120）不同于第一材料（110）。所述方法也包括将电路（130）与所加工的集成表面（112）相邻布置的步骤。所述方法还包括将第二材料