Method of manufacturing semiconductor device

The invention provides a method of manufacturing a semiconductor device. A hole is formed to pass through preliminary first mold layers and preliminary second mold layers to form first mold layers andmold layers respectively that are alternately stacked in a vertical direction, perpendicular to a lower structure, on the lower structure. The first mold layers are partially etched along a side surface of the hole to form recess regions and recessed first mold layers. Third mold layers are formed in the recess regions to form interlayer insulation layers so that each of the interlayer insulationlayers includes a corresponding third mold layer and a corresponding recessed first mold layer that are positioned at the same level in the vertical direction. A first dielectric layer is formed in the hole to cover the third mold layers and the second mold layers stacked on each other. Information storage patterns are formed on the first dielectric layer. 本发明提供一种制造半导体器件的方法，该方法被如下提供。形成孔以穿过初始第一模层和初始第二模层以分别形成在垂直于下部结构的垂直方向上交