Semiconductor package with leadframe interconnection structure

The invention discloses a semiconductor package. An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads whichis not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in astacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnectswhich attach the laser module and driver die to the leadframe. 本发明公开了半导体封装，半导体封装的实施例包括引线框架以及模制化合物，所述模制化合物部分地包封所述引线框架，使得引线从模制化合物伸出，并且至少两个管芯焊盘具有处于引线框架的第一侧的未被所述模制化合物覆盖的表面。激光模块附接到至少两个管芯焊盘的未被模制化合物覆盖的表面。驱动器管芯在引线框架的与所述第一侧相对的第二侧附接至引线框架