High temperature coatings for a preclean and etch apparatus and related methods

The invention discloses high temperature coatings for a preclean and etch apparatus and related methods. A pre-clean/etch apparatus comprising: a reaction chamber; a wafer holder; a gas transport path; a gas distribution device; a gas manifold; and a remote plasma unit; at least one of the wafer hol...

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Bibliographische Detailangaben
Hauptverfasser: GAO PEIPEI, WANG WENTAO, NAGARAJ PRAJWAL, DEMOS ALEXANDROS, WEI CHUANG, LIN XING, MA MINGYANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses high temperature coatings for a preclean and etch apparatus and related methods. A pre-clean/etch apparatus comprising: a reaction chamber; a wafer holder; a gas transport path; a gas distribution device; a gas manifold; and a remote plasma unit; at least one of the wafer holder, the reaction chamber, the gas transport path, the gas distribution device, the gas manifold, orthe remote plasma unit comprises a coating with a first layer and a second layer; at least one of the first layer or the second layer of the coating is formed by atomic layer deposition (ALD); and the first layer and the second layer comprise different materials. A method for forming a coating comprises: preparing a first surface to be coated; cleaning the first surface; depositing a first coating layer on the first surface with an atomic layer deposition (ALD) technique; depositing a second coating layer on the first coating layer; repeating the step of forming the first coating layer and forming the second coating