ADHESIVE FILM FOR CIRCUIT CONNECTIONS AND MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE FILM HOUSING SET

This adhesive film 1 for circuit connections is provided with a first adhesive layer 2 containing conductive particles 4, and a second adhesive layer 3 laminated on said first adhesive layer 2, wherein the ratio of the DSC calorific value of the first adhesive layer 2 to the DSC calorific value of t...

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Bibliographische Detailangaben
Hauptverfasser:	MORIJIRI TOMOKI, OTO YUMIKO, KUDOU SUNAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	This adhesive film 1 for circuit connections is provided with a first adhesive layer 2 containing conductive particles 4, and a second adhesive layer 3 laminated on said first adhesive layer 2, wherein the ratio of the DSC calorific value of the first adhesive layer 2 to the DSC calorific value of the second adhesive layer 3 is less than or equal to 0.4. 一种电路连接用粘接剂膜1，其具备：含有导电粒子4的第一粘接剂层2、和层叠于该第一粘接剂层2上的第二粘接剂层3，第一粘接剂层2的DSC放热量相对于第二粘接剂层3的DSC放热量的比小于或等于0.4。