CARRIER SUBSTRATE AND PACKAGING METHOD USING THE SAME

CARRIER SUBSTRATE AND PACKAGING METHOD USING THE SAME

A carrier substrate and a packaging method, the carrier substrate including a first layer; a second layer; and a first glue layer between the first layer and the second layer, wherein the first glue layer is removably attached to the first layer. 本申请提供了载体基板和封装方法，所述载体基板包括第一层、第二层和在第一层与第二层之间的第一胶层，其中所述第...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIM WONKEUN, KO JI-HAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A carrier substrate and a packaging method, the carrier substrate including a first layer; a second layer; and a first glue layer between the first layer and the second layer, wherein the first glue layer is removably attached to the first layer. 本申请提供了载体基板和封装方法，所述载体基板包括第一层、第二层和在第一层与第二层之间的第一胶层，其中所述第一胶层可移除地附接到第一层。