Concurrent remote calling system of embedded equipment
The invention provides a concurrent remote calling system of embedded equipment. The concurrent remote calling system comprises an RPC remote calling module; the RPC remote calling module comprises afirst layer, a second layer, a third layer and a fourth layer; wherein the first layer of data is tra...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a concurrent remote calling system of embedded equipment. The concurrent remote calling system comprises an RPC remote calling module; the RPC remote calling module comprises afirst layer, a second layer, a third layer and a fourth layer; wherein the first layer of data is transmitted to the second layer, the second layer of data is transmitted to the third layer, and the third layer of data is transmitted to the fourth layer; the first layer includes: a first electrode; an rpc _ socket module, a td _ epoll module, a td _ socket module and a td _ epoll module; the thirdlayer includes: a first layer; an rpc _ client module, an rpc _ server module, an rpc _ client module and an rpc _ server module; the rpc _ socket module and the td _ epoll module receive data at thesame time; the data is simultaneously transmitted to the second layer to be processed; the second layer transmits the processed data to the rpc _ client module and the rpc _ server module at the sametime for processing, and th |
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