Universal electroplating additive and preparation method thereof

The invention discloses a universal electroplating additive. The universal electroplating additive is prepared from the following raw materials in parts by weight: sodium tartrate, sodium citrate, benzylidene acetone, 2-mercapto benzimidazole, 2-ethylhexyl sodium sulfate and allylthiourea. The universal electroplating additive disclosed by the invention can be suitable for various electroplating processes such as copper plating, zinc plating and copper-zinc alloy plating, and the flatness and glossiness of a surface plating layer of an electroplated product are greatly improved; and the corrosion resistance can be remarkably improved, the hardness of the plating layer is improved, and the current efficiency, the dispersion capacity and other properties of a plating solution are well improved. 本发明公开了一种通用型电镀添加剂，由包括以下重量份的原料制成：酒石酸钠、柠檬酸钠、苄叉丙酮、2-巯基苯并咪唑、2-乙基己基硫酸钠、烯丙基硫脲。本发明的通用型电镀添加剂可适用于多种电镀工艺使用，如镀铜、镀锌、镀铜锌合金等，且均对电镀产品的表面镀层平整度、光泽度具有大大的改善，还可显著提高耐腐蚀性能，改善镀层硬度，以及使镀液的电流效率、分散能力等性能均得到很好的改善。