Test bar bonding tool capable of adjusting thickness of adhesive layer and using method

The invention relates to the technical field of surface bonding and detection, and discloses a test bar bonding tool capable of adjusting a thickness of an adhesive layer and a using method. The toolcomprises a base. Two or more sets of threaded holes are arranged in the base at equal intervals, eac...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LIU ZHENZI, XU KAI, SHI WENHAO, WANG YUNLONG, ZHOU ZIZHAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
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