Test bar bonding tool capable of adjusting thickness of adhesive layer and using method

The invention relates to the technical field of surface bonding and detection, and discloses a test bar bonding tool capable of adjusting a thickness of an adhesive layer and a using method. The toolcomprises a base. Two or more sets of threaded holes are arranged in the base at equal intervals, eac...

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Bibliographische Detailangaben
Hauptverfasser: LIU ZHENZI, XU KAI, SHI WENHAO, WANG YUNLONG, ZHOU ZIZHAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of surface bonding and detection, and discloses a test bar bonding tool capable of adjusting a thickness of an adhesive layer and a using method. The toolcomprises a base. Two or more sets of threaded holes are arranged in the base at equal intervals, each set of threaded holes comprises a reference test bar threaded hole and a test bar threaded hole,and the reference test bar threaded holes and the test bar threaded holes are coaxially arranged; and the reference test bar threaded holes are fixedly connected with a reference test bar, the test bar threaded holes are rotatably connected with a test bar, the reference test bar and the base are fixed, and a gap between the test bar and the reference test bar is adjusted by adjusting a length ofthe test bar screwed into the test bar threaded holes so as to meet bonding requirements of different bonding adhesive layer thicknesses. 本发明涉及表面粘接及检测技术领域,公开了一种可调胶层厚度的试棒粘接工装及使用方法。工装包括:底座,底座上等距设置有两组或两组以上的螺纹孔,每组螺纹孔包括基准试棒螺纹孔和试棒螺纹孔