Preparation method of high-hardness silver-copper-nickel alloy conductive ring
The invention discloses a preparation method of a high-hardness silver-copper-nickel alloy conductive ring and belongs to the technical field of preparation of conductive slip rings. The preparation method of the high-hardness silver-copper-nickel alloy conductive ring comprises the following steps:...
Gespeichert in:
Hauptverfasser: | , , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses a preparation method of a high-hardness silver-copper-nickel alloy conductive ring and belongs to the technical field of preparation of conductive slip rings. The preparation method of the high-hardness silver-copper-nickel alloy conductive ring comprises the following steps: (1) smelting a silver-copper-nickel alloy into an ingot, and carrying out homogenization heat treatment, forging and rolling to form an alloy plate blank; and (2) performing heat treatment and wire cutting on the alloy plate blank obtained in the step (1) to obtain the silver-copper-nickel alloy conductive ring. The high-hardness silver-copper alloy conductive ring prepared by the method does not have the phenomena of inclusions, pits, perforations, defects and the like, is uniform in texture and good in performance.
本发明公开了属于导电滑环制备技术领域的一种高硬度银铜镍合金导电环的制备方法。一种高硬度银铜镍合金导电环的制备方法包括以下步骤:(1)将银铜镍合金熔炼成铸锭、均匀化热处理、锻造、轧制成合金板坯;(2)步骤(1)所得合金板坯经热处理、线切割,制得银铜镍合金导电环。本发明所得高硬度银铜合金导电环不存在夹杂、凹坑、穿孔、缺陷等现象,材质均匀,性能好。 |
---|