AMPLIFIER ASSEMBLY

An amplifier assembly may include a first heat sink plate that includes a first channel, a second heat sink plate that includes a second channel, and an amplifier rod disposed in the first channel andthe second channel. The second heat sink plate may be connected with the first heat sink plate such...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FUNG SUSAN, STROEMBERG CHRISTOFFER, TUCKER DEREK A
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRICITY
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An amplifier assembly may include a first heat sink plate that includes a first channel, a second heat sink plate that includes a second channel, and an amplifier rod disposed in the first channel andthe second channel. The second heat sink plate may be connected with the first heat sink plate such that the first channel and the second channel align. The amplifier rod may be connected to the first heat sink plate and the second heat sink plate by a non-eutectic solder. 放大器组件可以包括具有第一通道的第一热沉板、具有第二通道的第二热沉板和设置在第一通道和第二通道中的放大器棒。第二热沉板可以连接第一热沉板使得第一通道和第二通道对准。放大器棒可以通过非共晶焊料连接到第一热沉板和第二热沉板。