Small-size high-linearity linear optocoupler device and manufacturing method thereof

The invention relates to the technical field of linear optoelectronic isolation, in particular to a small-size high-linearity linear optocoupler device which comprises a light-emitting diode chip, a thick film substrate, a meniscus dome and two photosensitive diode chips. A gold-plated bonding pad is arranged in the central area of the thick film substrate, and the light-emitting diode chip is arranged at the central point of the gold-plated bonding pad; the two photosensitive diode chips are installed on the surface of the gold-plated bonding pad and are symmetrical with the central point ofthe gold-plated bonding pad. A conduction band is printed on the gold-plated bonding pad, and the conduction band is used for connecting pins of each chip so that the whole device forms a path; the inner surface of the meniscus dome is electroplated with a roughened reflecting mirror surface, the meniscus dome is installed on the thick film substrate, and the chip on the gold-plated bonding pad islocated in the meniscus d