Terminal dual-face tin soldering coating device

The invention discloses a terminal dual-face tin soldering coating device, and belongs to the technical field of terminal tin soldering coating devices. The device comprises a worktable, a scaling powder coating mechanism, an automatic tin soldering mechanism, a pressing turnover mechanism and a tra...

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Bibliographische Detailangaben
Hauptverfasser: XIAO FEIHONG, HU XIAOYAN, HU JIANGWEI, LI XIANGCHENG, MAI XINGCHI, WANG HUAYU, MAI PUYAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a terminal dual-face tin soldering coating device, and belongs to the technical field of terminal tin soldering coating devices. The device comprises a worktable, a scaling powder coating mechanism, an automatic tin soldering mechanism, a pressing turnover mechanism and a transverse feeding mechanism. The pressing turnover mechanism comprises a feeding table, a terminal storage assembly and a turnover assembly, the terminal storage assembly comprises a moving part, two supporting frames, two storage frames and two moving strips, the storage frames are of hollow structures, and multiple pressing rods are mounted on each moving strip. Through the moving part, multiple terminal side walls can be pressed, falling of terminals in the turnover process can be avoided, through the turnover assembly, terminal turnover can be achieved, two end faces of the terminals can be subjected to scaling powder coating and tin soldering work, under the effect of the scaling powder coating mechanism and the