THERMOELECTRIC MATERIAL AND THERMOELECTRIC MODULE
Provided is a thermoelectric material (1) having: a parent phase (10) containing a MgSiSn alloy as a main component; vacancies (12) formed in the parent phase (10); and a silicon layer which is formedon at least the wall surfaces of the vacancies (12) and contains silicon as a main component. The th...
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Hauptverfasser: | , , , , , , |
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Format: | Patent |
Sprache: | chi ; eng |
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