THERMOELECTRIC MATERIAL AND THERMOELECTRIC MODULE

Provided is a thermoelectric material (1) having: a parent phase (10) containing a MgSiSn alloy as a main component; vacancies (12) formed in the parent phase (10); and a silicon layer which is formedon at least the wall surfaces of the vacancies (12) and contains silicon as a main component. The th...

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Bibliographische Detailangaben
Hauptverfasser: KOYANO MIKIO, TOYODA TAKESHI, SOTOME TSUYOSHI, TSURUMI SHIGEYUKI, MINAMIKAWA TOSHIHARU, MATOBA AKINARI, YASUDA KAZUMASA
Format: Patent
Sprache:chi ; eng
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