Flip light bar die bonding and eutectic all-in-one machine and flip light bar packaging process

The invention relates to the technical field of LED packaging, in particular to a flip light bar die bonding and eutectic all-in-one machine and a flip light bar packaging process. A feeding turntableframe is connected to one end of a die bonding mechanism; the other end of the die bonding mechanism is communicated with a buffer tank; the other end of the buffer box is communicated with an eutectic furnace body, a buffer guide plate is arranged in the buffer box, one end of the buffer guide plate is connected to the die bonding mechanism, the other end of the buffer guide plate is connected to the eutectic furnace body, a communication port is formed in one end of the die bonding mechanism, a heating guide rail is arranged in the eutectic furnace body, one end of the buffer guide plate isconnected to the communication port, and the other end is connected with one end of the heating guide rail. Compared with the machines and the processes in the prior art, according to the flip lightbar die bonding and eutecti