Flip lamp bead die bonding and eutectic all-in-one machine and flip lamp bead packaging process

The invention relates to the technical field of LED packaging, in particular to a flip lamp bead die bonding and eutectic all-in-one machine and a flip lamp bead packaging process. Two die bonding stations are used for eutectic; a chip feeding mechanism is arranged between the two die bonding stations and used for feeding LED chips, the front end of each die bonding station is provided with a support feeding mechanism used for providing a lamp bead support for the die bonding station, an eutectic furnace body internally comprises two eutectic tracks arranged in parallel, one end of each eutectic track is connected to the die bonding station, and the other end of each eutectic track is provided with a material receiving mechanism used for collecting the LED chips completing eutectic and thelamp bead supports. Compared with the machines and the processes in the prior art, the flip lamp bead die bonding and eutectic all-in-one machine and the flip lamp bead packaging process have the advantages that wire bonding