Anti-vibration three-dimensional stacked circuit structure and preparation method thereof

The invention provides an anti-vibration three-dimensional stacked circuit structure and a preparation method thereof, which belong to the field of microelectronic packaging. The anti-vibration three-dimensional stacked circuit structure comprises a packaging bottom plate, a metal shell arranged on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUN CONGKE, HU ZHANKUI, TANG XIAODONG, SONG XUEFENG, RONG ZILONG, DONG XUE, ZHAO RUIHUA, ZHANG YANQING, CHANG QINGSONG, WEI SHAOWEI, XU DA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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