Anti-vibration three-dimensional stacked circuit structure and preparation method thereof

The invention provides an anti-vibration three-dimensional stacked circuit structure and a preparation method thereof, which belong to the field of microelectronic packaging. The anti-vibration three-dimensional stacked circuit structure comprises a packaging bottom plate, a metal shell arranged on the upper surface of the packaging bottom plate in a sealing and covering mode and matched with thepackaging bottom plate to form a containing cavity, circuit substrates arranged in the containing cavity in a stacked mode in the vertical direction, circuit elements arranged on the upper surfaces ofthe circuit substrates, and first solder balls arranged on the adjacent circuit substrates, wherein the circuit substrate located at the bottom layer is fixedly connected with the packaging bottom plate, a buffer glue layer fixedly connected with the two adjacent circuit substrates is further arranged between the adjacent circuit substrates, and the buffer glue layer is located on the outer sideof the circuit element. Acc