Jet flow type electrochemical deposition device

The invention discloses a jet flow type electrochemical deposition device. The device comprises an electroplating bath, wherein one or more jet flow mechanisms, cathodes and the anodes can be arrangedside by side in the electroplating tank, electrolysis on one or more substrates can be met, a substr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HOU LIRAN, XIONG BANGGUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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