Jet flow type electrochemical deposition device

The invention discloses a jet flow type electrochemical deposition device. The device comprises an electroplating bath, wherein one or more jet flow mechanisms, cathodes and the anodes can be arrangedside by side in the electroplating tank, electrolysis on one or more substrates can be met, a substrate fixing frame is mounted in the electroplating tank, a substrate is mounted on the substrate fixing frame, the jet flow mechanisms are symmetrically arranged on the two sides of the substrate fixing frame, the jet flow mechanisms are provided with hollow shells, diaphragms and jet flow plates are mounted on the two sides of the jet flow mechanism respectively, cathode chambers are arranged on the side of the jet flow plates, and anode chambers are arranged on the side of the diaphragms. According to the device, through the design of the jet flow fixing plates, the diaphragms separate the catholyte in the cathode chamber and the anolyte in the anode chamber, an additive is not required tobe added in the solution